Description
Intelligent Power Modules (IPMs) are increasingly used in modern power
electronic systems because they combine power switches, gate drivers, and
protection functions into a compact and efficient solution. While this simplifies
system design, understanding the thermal behavior inside these modules remains
challenging. Heat generated by one component can influence the temperature of neighboring components, affecting both performance and reliability.

Your task
• Study thermal behavior of SiC and GaN based IPMs.
• Investigate thermal interactions between power switches, gate drivers, and
integrated temperature sensors.
• Develop and build a laboratory setup for thermal characterization.
• Perform measurements and identify thermal transfer functions within an IPM.
• Explore failure mechanisms and lifetime models of SiC and GaN devices.
• Develop simulation models to predict module lifetime.

Contact
For more information, please contact Sven Maes: [email protected]